Semiconductor structure and manufacturing method thereof

ABSTRACT

A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a semiconductor substrate, an interconnection structure, a through substrate via, an insulating layer, a conductive pillar, a dummy conductive pillar, a passivation layer and a bonding pad. The interconnection structure is disposed over the semiconductor substrate. The through substrate via at least partially extends in the semiconductor substrate along a thickness direction of the semiconductor substrate, and electrically connects to the interconnection structure. The insulating layer is disposed over the interconnection structure. The conductive pillar is disposed in the insulating layer, and electrically connected to the through substrate via. The dummy conductive pillar is disposed in the insulating layer, and laterally separated from the conductive pillar. The passivation layer is disposed over the insulating layer. The bonding pad is disposed in the passivation layer, and electrically connected to the conductive pillar.

BACKGROUND

In recent years, the semiconductor industry has experienced rapid growthdue to continuous improvement in integration density of variouselectronic components. These continuously scaled electronic componentsrequire smaller packages that occupy less area than previous packages.Exemplary types of packages include quad flat pack (QFP), pin grid array(PGA), ball grid array (BGA), flip chips (FC), three dimensionalintegrated circuits (3DICs), wafer level packages (WLPs) and package onpackage (PoP) devices. Some 3DICs prepared by stacking semiconductordies provide improved integration density and other advantages, such asfaster speeds and higher bandwidth, because of the decreased length ofinterconnects between the stacked chips. However, there are quite a fewchallenges to be handled for the technology of 3DICs.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a process flow diagram illustrating a manufacturing method ofa semiconductor structure according to some embodiments of the presentdisclosure.

FIG. 2A through FIG. 2L are schematic cross-sectional views illustratingstructures at various stages of the manufacturing method of thesemiconductor structure shown in FIG. 1.

FIG. 3A and FIG. 3B are schematic cross-sectional views illustratingsemiconductor structures according to some embodiments of the presentdisclosure.

FIG. 4A and FIG. 4B are schematic top views respectively illustrating aconfiguration of the conductive pillars and the dummy conductive pillarsaccording some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

It should be appreciated that the following embodiment(s) of the presentdisclosure provides applicable concepts that can be embodied in a widevariety of specific contexts. The embodiments are intended to providefurther explanations but are not used to limit the scope of the presentdisclosure.

FIG. 1 is a process flow diagram illustrating a manufacturing method ofa semiconductor structure according to some embodiments of the presentdisclosure. FIG. 2A through FIG. 2L are schematic cross-sectional viewsillustrating structures at various stages of the manufacturing method ofthe semiconductor structure shown in FIG. 1.

Referring to FIG. 1 and FIG. 2A, step S100 is performed, and asemiconductor substrate 100 with a device layer 102 and aninterconnection structure 104 formed thereon is provided. In someembodiments, the substrate 100 may be a semiconductor wafer or asemiconductor-on-insulator (SOI) wafer. The semiconductor material ofthe semiconductor wafer or the SOI wafer may include an elementalsemiconductor, a semiconductor alloy or a semiconductor compound. Forinstance, the elemental semiconductor may include Si or Ge. Thesemiconductor alloy may include SiGe, SiGeC or the like. Thesemiconductor compound may include SiC, a III-V semiconductor or a II-VIsemiconductor. Furthermore, the semiconductor substrate 100 may be dopedwith a first conductive type or a second conductive type complementaryto the first conductive type. For instance, the first conductive typemay be N type, whereas the second conductive type may be P type.

The device layer 102 may extend into the semiconductor substrate 100from above the semiconductor substrate 100. In some embodiments, thedevice layer 102 includes active devices, passive devices or acombination thereof. For instance, the active devices may includetransistors, diodes, the like or combinations thereof, whereas thepassive devices may include resistors, capacitors, inductors, the likeor combinations thereof. The active devices and the passive devices mayinclude stacking structures SS formed over the semiconductor substrate100, and may include doped regions DR formed in the semiconductorsubstrate 100. The stacking structures SS may be, for example, gatestructures, and the doped regions DR may respectively have a conductivetype the same as or complementary to a conductive type of thesemiconductor substrate 100. In addition, the device layer 102 mayfurther include contact plugs CP formed over the semiconductor substrate100, and may include isolation structures (not shown) formed in or overthe semiconductor substrate 100. The contact plugs CP electricallyconnect the active devices and the passive devices to theinterconnection structure 104 formed thereon, whereas the isolationstructures, such as shallow trench isolation (STI) structures or deeptrench isolation (DTI) structures, are functioned to isolate the activedevices and the passive devices from one another. The contact plugs CPand portions of the active devices and/or the passive devices (e.g., thestacking structures SS) over the semiconductor substrate 100 may beformed in an interlayer dielectric layer IL. The active devices and/orthe passive devices are covered by the interlayer dielectric layer IL,and the contact plugs CP can be regarded as penetrating through theinterlayer dielectric layer IL. In some embodiments, a region of theinterlayer dielectric layer IL is substantially free of the activedevices, the passive devices and the contact plugs CP, and the throughsubstrate vias 110 formed in the following step (as shown in FIG. 2B)may penetrate through this region of the interlayer dielectric layer IL.

The interconnection structure 104 is formed over the device layer 102,and includes a stack of dielectric layers 106 and interconnectionelements 108 formed in the stack of dielectric layers 106. Theinterconnection elements 108 are electrically connected to the activedevices and/or the passive devices in the device layer 102 via, forexample, the contact plugs CP. In some embodiments, the interconnectionelements 108 respectively include a conductive trace, a conductive viaor a combination thereof. The conductive trace horizontally extends onone of the dielectric layers 106 or the device layer 102, whereas theconductive via penetrates one of the dielectric layers 106 andelectrically connect to one of the conductive traces. The active devicesand/or the passive devices in the device layer 102 along with theinterconnection elements 108 in the interconnection structure 104constitute an integrated circuit. The integrated circuit may be a memoryintegrated circuit, a logic integrated circuit, an application-specificintegrated circuit (ASIC) or the like. In some embodiments, a region ofthe interconnection structure 104 is substantially free of theinterconnection elements 108, and the through substrate vias 110 formedin the following step (as shown in FIG. 2B) may penetrate through thisregion of the interconnection structure 104.

Referring to FIG. 1, FIG. 2A and FIG. 2B, step S102 is performed, andthe through substrate vias 110 are formed. The through substrate vias110 may include signal through substrate via(s), ground throughsubstrate via(s), the like or combinations thereof. Even though 3through substrate vias 110 are depicted in FIG. 2B, less than 3 or morethan 4 through substrate via(s) 110 could be formed. The presentdisclosure is not limited to an amount of the through substrate vias110. In some embodiments, the through substrate vias 110 extend along athickness direction of the current structure from an exposed surface ofthe interconnection structure 104 (also referred as a front surface 1040into the semiconductor substrate 100 through the interconnectionstructure 104 and the device layer 102. In these embodiments, thethrough substrate vias 110 may be tapered along their extendingdirection. In addition, the through substrate vias 110 are laterallyseparated from one another, and may penetrate through the region of theinterconnection structure 104 substantially free of the interconnectionelements 108 and the region of the interlayer dielectric layer ILsubstantially free of the active devices, the passive devices and thecontact plugs CP. In some embodiments, a terminal (e.g., a bottomterminal) of each through substrate via 110 is currently buried in thesemiconductor substrate 100. In other words, in these embodiments, thethrough substrate vias 110 do not penetrate through the semiconductorsubstrate 100 in the current step. A material of the through substratevias 110 may include Cu, Al, Ni, Sn, the like or combinations thereof. Amethod for forming the through substrate vias 110 may include formingopenings that are extending from the front surface 104 f of theinterconnection structure 104 into the semiconductor substrate 100, andfilling a conductive material into these openings to form the throughsubstrate vias 110. In some embodiments, these openings foraccommodating the through substrate vias 110 are formed via a drillingprocess (e.g., a laser drilling process), and the conductive materialfilled into these opening is formed by a plating process (e.g., anelectroplating process or an electroless plating process). Theconductive material may initially extend onto the exposed surface of theinterconnection structure 104. Thereafter, a planarization process(e.g., a chemical mechanical polishing (CMP) process, a grindingprocess, an etching process or combinations thereof) may be performed toremove portions of the conductive material above the interconnectionstructure 104, so as to form the through substrate vias 110 as shown inFIG. 2B. In some embodiments, exposed surfaces of the through substratevias 110 (also referred as front surfaces 110 f of the through substratevias 110) are substantially coplanar with the front surface 104 f of theinterconnection structure 104.

Moreover, in some embodiments, at least one lining layer and at leastone barrier layer (both not shown) are sequentially formed on a bottomsurface and a sidewall of each opening before filling the conductivematerial into these openings. As such, after forming the throughsubstrate vias 110, a bottom surface and a sidewall of each throughsubstrate via 110 may be covered by the lining layer and the barrierlayer (both not shown). A material of the lining layer may be aninsulating layer, such as silicon oxide, silicon nitride, the like orcombinations thereof, whereas a material of the barrier layer mayinclude Ta, TaN, Ti, TiN, the like or combinations thereof. A method forforming the lining layer may include a deposition process (e.g., achemical vapor deposition (CVD) process), whereas a method for formingthe barrier layer may include a deposition process (e.g., a physicalvapor deposition (PVD) process or a CVD process), a plating process(e.g., an electroplating process or an electroless plating process) or acombination thereof. In addition, the through substrate vias 110described above are formed by a through substrate via last (TSV last)process, since the formation of the through substrate vias 110 followsthe formation of the device layer 102 and the interconnection structure104. However, a TSV middle process or a TSV first process may bealternatively applied (respectively illustrated with reference to FIG.3A and FIG. 3B in the following paragraphs) for forming the devicelayer, the interconnection structure and the through substrate vias, thepresent disclosure is not limited to the sequential order of thesesteps.

Referring to FIG. 1, FIG. 2B and FIG. 2C, step S104 is performed, andconductive pads 112 a, dummy pads 112 b and a passivation layer 114 areformed over the interconnection structure 104 and the through substratevias 110. The conductive pads 112 a and the dummy pads 112 b can beregarded as being located in the passivation layer 114. The conductivepads 112 a are overlapped and electrically connected with the throughsubstrate vias 110, respectively. In addition, at least some of theconductive pads 112 a may further extend into the interconnectionstructure 104, so as to be electrically connected with theinterconnection elements 108 in the interconnection structure 104. Insome embodiments, substantially the whole front surface 110 f of eachthrough substrate via 110 is covered by the overlying conductive pad 112a. In these embodiments, an area of the conductive pad 112 a may begreater than an area of the front surface 110 f of the through substratevia 110. On the other hand, the dummy pads 112 b are not electricallyconnected to the through substrate vias 110 nor the interconnectionstructure 104. In some embodiments, the dummy pads 112 b areelectrically floated or grounded. A material of the conductive pads 112a and the dummy pads 112 b may include Al, Cu, Ni, the like orcombinations thereof. the like or combinations thereof. A method forforming the conductive pads 112 a and the dummy pads 112 b may includeremoving some portions of the topmost dielectric layer 106 to exposesome portions of the interconnection elements 108, and then forming theconductive pads 112 a and the dummy pads 112 b by a deposition process(e.g., a PVD process) and/or a plating process (e.g., an electroplatingprocess or an electroless plating process) with patterns defined by aphotoresist layer. Thereafter, an insulating material layer may beformed over the interconnection structure 104, the conductive pads 112 aand the dummy pads 112 b by a deposition process (e.g. a CVD process) ora solution process (e.g., a spin coating process), and then aplanarization process (e.g., a CMP process, a grinding process, anetching process or combinations thereof) may be performed to removeportions of the insulating material layer above the conductive pads 112a and the dummy pads 112 b, so as to form the passivation layer 114shown in FIG. 2C. Alternatively, the conductive pads 112 a, the dummypads 112 b and the passivation layer 114 may be formed by a damasceneprocess. In these alternative embodiments, an insulating material layeris globally formed over the interconnection structure 104 and thethrough substrate vias 110, and openings are formed in this insulatingmaterial layer, so as to form the passivation layer 114 shown in FIG.2C. Thereafter, the conductive pads 112 a and the dummy pads 112 b areformed in these openings by a deposition process and/or a platingprocess, along with a planarization process. In some embodiments,exposed surfaces of the conductive pads 112 a and the dummy pads 112 b(also referred as front surfaces 112 f of the conductive pads 112 a andthe dummy pads 112 b) are substantially coplanar with an exposed surfaceof the passivation layer 114 (also referred as a front surface 114 f ofthe passivation layer 114). A material of the passivation layer 114 mayinclude silicon nitride, silicon oxide, the like or combinationsthereof.

Referring to FIG. 1, FIG. 2C and FIG. 2D, step S106 is performed, and aninsulating layer 116, conductive pillars 118 and dummy conductivepillars 120 are formed over the conductive pads 112 a, the dummy pads112 b and the passivation layer 114. The conductive pillars 118 and thedummy conductive pillars 120 can be regarded as being located in theinsulating layer 116. The conductive pillars 118 are overlapped andelectrically connected with the conductive pads 112 a, respectively. Thedummy conductive pillars 120 are located aside the conductive pillars118, and may be laterally separated from one another. The dummyconductive pillars 120 may be overlapped and in contact with the dummypads 112 b, but may not be electrically connected to the conductivepillars 118, the conductive pads 112 a, the through substrate vias 110nor the interconnection structure 104. In some embodiments, both of thedummy pads 112 b and the dummy conductive pillars 120 may beelectrically floated or grounded. In addition, in some embodiments,exposed surfaces of the conductive pillars 118 (also referred as frontsurfaces 118 f), exposed surfaces of the dummy conductive pillars 120(also referred as front surfaces 1200 are substantially coplanar with anexposed surface of the insulating layer 116 (also referred as a frontsurface 116 f). A material of the conductive pillars 118 and the dummyconductive pillars 120 may include Cu, Al, Ni, Sn, the like orcombinations thereof, whereas a material of the insulating layer 116 mayinclude silicon oxide, silicon nitride, silicon oxynitride, siliconcarbonitride, the like or combinations thereof. In some embodiments, theinsulating layer 116, the conductive pillars 118 and the dummyconductive pillars 120 may be formed by a damascene process. In theseembodiments, an insulating material layer may be initially formed overthe conductive pads 112 a, the dummy pads 112 b and the passivationlayer 114 by a deposition process (e.g., a CVD process) or a solutionprocess (e.g., a spin coating process), then openings are formed in thisinsulating material layer to form the insulating layer 116 as shown inFIG. 2D. Thereafter, the conductive pillars 118 and the dummy conductivepillars 120 are formed in these openings by a plating process (e.g., anelectroplating process or an electroless plating process) and/or adeposition process (e.g., a PVD process), along with a planarizationprocess (e.g., a CMP process, a grinding process, an etching process orcombinations thereof). In alternative embodiments, the conductivepillars 118 and the dummy conductive pillars 120 may be formed beforeforming the insulating layer 116. In these alternative embodiments, theconductive pillars 118 and the dummy conductive pillars 120 may beformed by a deposition process and/or a plating process with patternsdefined by a photoresist layer. Subsequently, an insulating materiallayer is globally formed over the current structure. Thereafter, aplanarization process may be performed to remove portions of theinsulating material layer above the conductive pillars 118 and the dummyconductive pillars 120, so as to form the insulating layer 116 as shownin FIG. 2D. In some embodiments, an aspect ratio (i.e., a ratio ofheight with respect to width) of the conductive pillars 118 and thedummy conductive pillars 120 may be greater than an aspect ratio of theconductive pads 112 a, an aspect ratio of the dummy pads 112 b and anaspect ratio of the bonding pads 122 formed in the following step (shownin FIG. 2E), but less than an aspect ratio of the through substrate vias110.

Referring to FIG. 1, FIG. 2D and FIG. 2E, step S108 is performed, andbonding pads 122 and a passivation layer 124 are formed over theinsulating layer 116, the conductive pillars 118 and the dummyconductive pillars 120. The bonding pads 122 can be regarded as beinglocated in the passivation layer 124. In addition, the bonding pads 122are overlapped and electrically connected with the conductive pillars118, respectively. In some embodiments, substantially the whole frontsurface 118 f of each conductive pillar 118 is covered by the overlyingbonding pad 122. In these embodiments, an area of each bonding pad 122may be greater than an area of the conductive pillar 118. On the otherhand, the dummy conductive pillars 120 are covered by the passivationlayer 124, rather than being overlapped with the bonding pads 122.Accordingly, a stacking structure including the dummy pads 112 b and thedummy conductive pillars 120 may be respectively wrapped by the topmostdielectric layer 106, the passivation layer 114, the insulating layer116 and the passivation layer 124, and may not be electrically connectedto the interconnection structure 104, the through substrate vias 110,the conductive pads 112 a and the bonding pads 122. In some embodiments,exposed surfaces of the bonding pads 122 (also referred as frontsurfaces 1221) are substantially coplanar with an exposed surface of thepassivation layer 124 (also referred as a front surface 124 f). Amaterial of the bonding pads 122 may include Cu, Al, Ni, Sn, the like orcombinations thereof, whereas a material of the passivation layer 124may include silicon oxide, silicon nitride, silicon oxynitride, siliconcarbonitride, the like or a combination thereof. In some embodiments,the bonding pads 122 and the passivation layer 124 may be formed by adamascene process. In these embodiments, an insulating material layermay be initially formed over the insulating layer 116, the conductivepillars 118 and the dummy conductive pillars 120 by a deposition process(e.g., a CVD process) or a solution process (e.g., a spin coatingprocess), then openings are formed in this insulating material layer bya lithography process and an etching process, to form the passivationlayer 124 as shown in FIG. 2E. Thereafter, the bonding pads 122 areformed in these openings by a plating process (e.g., an electroplatingprocess or an electroless plating process), a deposition process (e.g.,a PVD process) or a combination thereof, along with a planarizationprocess (e.g., a CMP process, a grinding process, an etching process orcombinations thereof). In alternative embodiments, the bonding pads 122may be formed before forming the passivation layer 124. In thesealternative embodiments, the bonding pads 122 are formed over theconductive pillars 118 by a deposition process and/or a plating processwith patterns defined by a photoresist layer, then an insulatingmaterial layer is globally formed over the current structure.Thereafter, a planarization process may be performed to remove portionsof the insulating material layer above the bonding pads 122, so as toform the passivation layer 124 as shown in FIG. 2E.

Referring to FIG. 1, FIG. 2E and FIG. 2F, step S110 is performed, andthe semiconductor substrate 100 is thinned from a back side of thesemiconductor substrate 100 that is facing away from the interconnectionstructure 104. In some embodiments, the terminals (e.g., the bottomterminals) of the through substrate vias 110 are still buried in thesemiconductor substrate 100, except that a distance between theterminals of the through substrate vias 110 and a back surface 100 b ofthe semiconductor substrate 100 is shortened after the thinning process.In alternative embodiments, the through substrate vias 110 are exposedafter performing the thinning process on the semiconductor substrate100. For instance, a total thickness of the current structure measuredfrom the back surface 100 b of the semiconductor substrate 100 to thefront surface 124 f of the passivation layer 124 may range from 10 um to775 um. The thinning process may include a CMP process, a grindingprocess, an etching process or combinations thereof, and the passivationlayer 124 and the bonding pads 122 may be attached to a tape or acarrier (not shown) before performing the thinning process. Furthermore,after performing the thinning process, the current wafer structure maybe subjected to a singulation process. One of the singulated structures130 exemplarily depicted in FIG. 2F includes at least one of the throughsubstrate vias 110 and the overlying conductive pad 112 a, conductivepillar 118 and bonding pad 122, and also includes at least one of thedummy pads 112 b and the overlying dummy conductive pillar 120. Thesingulation process may include a dicing process, a sawing process, alaser ablation process, an etching process or combinations thereof.

Referring to FIG. 1, FIG. 2F and FIG. 2G, step S112 is performed, and atleast one of the singulated structures 130 (e.g., 2 of the singulatedstructures 130) is picked and placed onto an base structure 132. In someembodiments, the base structure 132 is a device die (e.g., a logic die),and has integrated circuits formed therein (not shown). In theseembodiments, an active side of the device die may be attached with thesingulated structures 130, whereas a back side of the device die mayface away from the attached singulated structures 130. Alternatively,the back side of the device die may be attached with the singulatedstructures 130, whereas the active side of the device die may face awayfrom the attached singulated structures 130. In addition, throughsubstrate vias (not shown), which is similar to the through substratevias 110, may be formed in the device die for realizing communicationbetween the active side and the back side of the device die. The activeside of the device die is referred as a side of the device die at whichintegrated circuits are formed, whereas the back side of the device dieis referred as another side of the device die away from the integratedcircuits. In some embodiments, the base structure 132 has a dielectriclayer 134 exposed at its surface, on which the singulated structures 130to be attached. Although not depicted, bonding pads may be disposed inthe dielectric layer 134 and may be exposed at the to-be-attachedsurface of the base structure 132. In some embodiments, the singulatedstructure 130 shown in FIG. 2F is flipped over and attached onto thebase structure 132. In these embodiments, the singulated structure 130may be attached onto the base structure 132 via the front surface 124 fof the passivation layer 124 and the front surfaces 122 f of the bondingpads 122. On the other hand, the back surface 100 b of the semiconductorsubstrate 100 is exposed, and facing away from the base structure 132.In some embodiments, each of the singulated structures 130 is attachedonto the base structure 132 by a hybrid bonding manner. In theseembodiments, the passivation layers 124 of the singulated structures 130are bonded with the dielectric layer 134 of the base structure 132,whereas the bonding pads 122 of the singulated structures 130 are bondedwith the bonding pads (not shown) in the dielectric layer 134 of thebase structure 132. For instance, the hybrid bonding between thesingulated structures 130 and the base structure 132 is carried out byan annealing process performed after placing the singulated structures130 onto the base structure 132. Since the front surfaces 120 f of thedummy conductive pillars 120 facing toward the base structure 132 arecovered by the passivation layer 124, the dummy conductive pillars 120are not in direct contact with the base structure 132, but separatedfrom the base structure 132 by the passivation layer 124. Thereby, thedummy conductive pillars 120 may be electrically isolated from the basestructure 132.

In alternative embodiments, the base structure 132 is a carrier (e.g., aglass carrier), and the dielectric layer 134 at a surface of the basestructure 132 may be a release layer (e.g., a thermal release layer or alight-to-heat-conversion (LTHC) release layer).

Referring to FIG. 1, FIG. 2G and FIG. 2H, step S114 is performed, andthe back surfaces 100 b of the semiconductor substrates 100 are recessedto expose the through substrate vias 110. Currently, the throughsubstrate vias 110 can be regarded as penetrating through thesemiconductor substrate 100. In some embodiments, the through substratevias 110 are protruded from the recessed back surfaces 100 b of thesemiconductor substrates 100. For instance, the through substrate vias110 may be protruded from the back surfaces 100 b of the semiconductorsubstrates 100 by a height ranging from 100 Å to 30 kÅ. A method forrecessing the back surfaces 100 b of the semiconductor substrates 100may include an etching process (e.g., an isotropic etching process or ananisotropic etching process), and a depth of the removed portions of thesemiconductor substrates 100 may be adjusted by a process time of theetching process.

Referring to FIG. 1, FIG. 2H and FIG. 2I, step S116 is performed, and anisolation layer 136 is formed over the structure shown in FIG. 2H. Assuch, a surface of the dielectric layer 134, sidewalls of the singulatedstructures 130 and top surfaces of the singulated structures 130(including the back surfaces 100 b of the semiconductor substrates 100and the exposed surfaces of the through substrate vias 110) are coveredby the isolation layer 136. A material of the isolation layer 136 mayinclude silicon nitride, silicon oxide or other insulating materials. Amethod for forming the isolation layer 136 may include a depositionprocess (e.g., a chemical vapor deposition process) or a solutionprocess (e.g., a spin coating process).

Referring to FIG. 1, FIG. 2I and FIG. 2J, step S118 is performed, and aplanarization process is performed on the isolation layer 136, so as toremove portions of the isolation layer 136 above the through substratevias 110. In this way, the through substrate vias 110 are exposed. Insome embodiments, back surfaces 110 b of the through substrate vias 110are slightly protruded from the isolation layer 136. In someembodiments, the planarization process includes a CMP process, agrinding process, an etching process or combinations thereof. Up tohere, semiconductor structures 10 respectively including one of thesingulated structures 130 (as labeled in FIG. 2I) and a portion of theisolation layer 136 covered thereon are formed over the base structure132. The semiconductor structures 10 may be regarded as semiconductordies, such as memory dies, logic dies, ASIC dies or the like.

Referring to FIG. 1 and FIG. 2H through FIG. 2K, in some embodiments,steps S112 through S116 (as shown in FIG. 2H through FIG. 2J) arerepeated, and semiconductor structures 20 (shown in FIG. 2K)respectively including a stack of the semiconductor structures 10 areformed over the base structure 132. The semiconductor structures 20 maybe respectively regarded as a die stack, and may be packaged along withthe base structure 132 and another semiconductor device in a finalpackage structure, or may be detached from the base structure 132 andpackaged with another semiconductor device in a final package structure.In one of the semiconductor structures 20, the bonding pads 122 of theupper semiconductor structure 10 are facing toward and bonded with theback surfaces 110 b (as labeled in FIG. 2J) of the through substratevias 110 in the lower semiconductor structure 10, so as to beelectrically connected with the through substrate vias 110 of the lowersemiconductor structure 10. Therefore, the conductive pillars 118 of theupper semiconductor structure 10 could be electrically connected to thelower semiconductor structure 10 via the bonding pads 122. In someembodiments, the previously protruded portions of the through substratevias 110 of the lower semiconductor structure 10 is compressed by theupper semiconductor structure 10, and may be no longer protruded fromthe surrounding isolation layer 136. On the other hand, the dummyconductive pillars 120 of the upper semiconductor structure 10 arevertically separated from the lower semiconductor structure 10 by thepassivation layer 124, thus are electrically isolated from the lowersemiconductor structure 10. In addition, as a result of the connectionmanner of the semiconductor structures 10 in the same semiconductorstructure 20, the back surfaces 110 b of the through substrate vias 110in the semiconductor structure 20 are all facing away from the basestructure 132, whereas the front surfaces 122 f of the bonding pads 122in the semiconductor structure 20 are all facing toward the basestructure 132. In some embodiments, the semiconductor structures 10 inthe same semiconductor structure 20 are bonded with one another by ahybrid bonding manner. As such, the passivation layer 124 of the uppersemiconductor structure 10 is bonded with the isolation layer 136 of thelower semiconductor structure 10, whereas the bonding pads 122 of theupper semiconductor structure 10 are bonded with the through substratevias 110 of the lower semiconductor structure 10. In these embodiments,a plurality of annealing processes may be respectively performed afterplacing each of the semiconductor structures 10 on the base structure132. Alternatively, a single annealing process may be performed afterall of the semiconductor structures 10 are placed on the base structure132. Furthermore, in some embodiments, the isolation layer 136 formedalong with the lower semiconductor structures 10 may be partiallyremoved when the upper semiconductor structures 10 are subjected to therecessing of the semiconductor substrates 100. The portion of theisolation layer 136 formed along with the lower semiconductor structures10 used to surround the lower semiconductor structures 10 is removed,whereas other portions of this isolation layer 136 covering the lowersemiconductor structures 10 are remained. Therefore, a portion of thebase structure 132 surrounding the lower semiconductor structures 10 isexposed during the step of recessing the semiconductor substrate 100 ofthe upper semiconductor structure 10. Subsequently, this portion of thebase structure 132 is once again covered after the formation of theisolation layer 136 formed along with the upper semiconductor structures10.

Referring to FIG. 2L, in some embodiments, the step S112 through S118(as shown in FIG. 2H through FIG. 2J) are repeated more than once, andeach of the semiconductor structures 20 may have more than 3semiconductor structures 10 (e.g., 4 semiconductor structures 10 asshown in FIG. 2L). In some embodiments, during the processing of thetopmost semiconductor substrate 10 in each semiconductor structure 20,the step S118 (performing planarization process on the isolation layer136) may be skipped. In these embodiments, the back surfaces 110 b ofthe through substrate vias 110 in the topmost semiconductor structure 10is covered by the isolation layer 136. In other embodiments, the topmostsemiconductor structure 10 does not have the through substrate vias 110.Furthermore, the semiconductor structures 20 and the base structure 132may be encapsulated by an encapsulant 138. In addition, a protectionlayer 140 may be formed at a bottom surface of the encapsulant 138 and abottom surface of the base structure 132. In those embodiments where thebase structure 132 is a device die, the bottom surface of the basestructure 132 may be the active side of the device die. Alternatively,the bottom surface of the base structure 132 may be the back side of thedevice die. The protection layer 140 has openings respectively expose aportion of the base structure 132, and electrical connectors 142 may berespectively disposed in these openings of the protection layer 140, soas to be electrically connected to the base structure 132. Theelectrical connectors 142 may include micro-bumps, controlled collapsechip connection (C4) bumps, ball grid array (BGA) balls, solder balls orthe like. Moreover, although it is not depicted, the current structureas shown in FIG. 2L may be further attached onto a circuit board or apackage substrate.

In summary, the semiconductor structure 20 according to embodiments inthe present disclosure includes a stack of the semiconductor structures10. The semiconductor structure 10 has the through substrate vias 110extending to a back side of the semiconductor structure 10, and has theconductive pillars 118 and the bonding pads 120 formed at a front sideof the semiconductor structure 10 for interconnecting between thethrough substrate vias 110 and another one of the semiconductorstructures 10 (or a pre-provided base structure 132). As compared toforming electrical connectors (e.g., micro-bumps or the like) atopposite sides of a semiconductor die for interconnecting with othersemiconductor dies, the conductive pillars 118 and the bonding pads 122of the embodiments in the present disclosure are formed at a single sideof the semiconductor structure 10. In this way, several process stepsincluding, for example, flipping over a wafer structure and attachingthe wafer structure to an additional carrier are no longer required, andformation of the conductive pillars 118 and the bonding pads 122 can beintegrated with a back-end-of-line (BEOL) process of the semiconductorstructure 10. In this way, a manufacturing cost of the semiconductorstructure 10 can be reduced. Moreover, in some embodiments, the dummypads 112 b and the dummy conductive pillars 120 are formed along withthe conductive pads 112 a and the conductive pillars 118 at the frontside of the semiconductor structure 10. The dummy pads 112 b areoverlapped and in contact with the dummy conductive pillars 120,respectively. The dummy pads 112 b are similar to the conductive pads112 a, except that the dummy pads 112 b may not participate in signaltransmitting. Similarly, the dummy conductive pillars 120 are similar tothe conductive pillars 118, except that the dummy conductive pillars 120may not participate in signal transmitting. By disposing the dummy pads112 b and the dummy conductive pillars 120, a volume ratio of a highthermal conductivity material (e.g., the conductive pillars 118, thedummy conductive pillars 120 and the bonding pads 122) with respect to alow thermal conductivity material (e.g., the insulating layer 116 andthe passivation layer 124) at a surface region of the semiconductorstructure 10 can be significantly increased, and a thermal resistance ofthe semiconductor structure 10 or the semiconductor structure 20 can beeffectively lowered. For instance, the thermal resistance of thesemiconductor structure 20 may be lowered to about 4.19° C.-mm²/W orless.

FIG. 3A is a schematic cross-sectional view illustrating a semiconductorstructure 10 a according to some embodiments of the present disclosure.The semiconductor structure 10 a as shown in FIG. 3A is similar to thesemiconductor structure 10 as shown in FIG. 2J, only differencestherebetween will be discussed, the like or the same parts will not berepeated again.

Referring to FIG. 2J and FIG. 3A, a major difference between thesemiconductor structure 10 a shown in FIG. 3A and the semiconductorstructure 10 shown in FIG. 2J lies in that the through substrate vias210 in the semiconductor structure 10 a do not penetrate through theinterconnection structure 104. In some embodiments, the throughsubstrate vias 210 extend from a front surface 102 f of the device layer102, which is facing away from the semiconductor substrate 100, to overthe back surface 100 b of the semiconductor substrate 100. In addition,the through substrate vias 210 may be electrically connected with theconductive pads 112 a through the interconnection elements 108 in theinterconnection structure 104. In some embodiments, some of the throughsubstrate vias 210 are electrically connected with the active devicesand/or passive devices in the device layer 102 by the interconnectionelements 108. Furthermore, in some embodiments, the conductive pads 112a are overlapped with the through substrate vias 210, respectively.However, in alternative embodiments (not shown), the conductive pads 112a are not overlapped with the through substrate vias 210. A method forforming the semiconductor structure 10 a as shown in FIG. 3A may includeapplying a TSV middle process, of which the formation of the throughsubstrate vias 210 follows the formation of the device layer 102 butprecedes the formation of the interconnection structure 104.

FIG. 3B is a schematic cross-sectional view illustrating a semiconductorstructure 10 b according to some embodiments of the present disclosure.The semiconductor structure 10 b as shown in FIG. 3B is similar to thesemiconductor structure 10 a as shown in FIG. 3A, only differencestherebetween will be discussed, the like or the same parts will not berepeated again.

Referring to FIG. 3A and FIG. 3B, a major difference between thesemiconductor structure 10 b shown in FIG. 3B and the semiconductorstructure 10 a shown in FIG. 3A lies in that the through substrate vias310 in the semiconductor structure 10 b do not penetrate through thedevice layer 102 and the interconnection layer 104. In some embodiments,the through substrate vias 310 extend from a front surface 100 f of thesemiconductor substrate 100, which is facing toward the interconnectionstructure 104, to over the back surface 100 b of the semiconductorsubstrate 100. In addition, additional contact plugs CP may be formed inthe interlayer dielectric layer IL of the device layer 102 forelectrically connecting the through substrate vias 310 to theinterconnection elements 108 in the interconnection structure 104. Inthis way, the through substrate vias 310 are electrically connected tothe conductive pads 112 a via the additional contact plugs CP and theinterconnection elements 108. A method for forming the semiconductorstructure 10 b as shown in FIG. 3B may include applying a TSV firstprocess, of which the formation of the through substrate vias 310precedes the formation of the device layer 102 and the interconnectionstructure 104.

FIG. 4A is a schematic top view illustrating a configuration of theconductive pillars 118 and the dummy conductive pillars 120 accordingsome embodiments of the present disclosure.

Referring to FIG. 4A, the conductive pillars 118 and the dummyconductive pillars 120 are distributed in the insulating layer 116. Eachconductive pillar 118 and each dummy conductive pillar 120 mayrespectively have a circular top view shape. However, those skilled inthe art may modify the top view shape of the conductive pillars 118 andthe dummy conductive pillars 120 (e.g., to be polygonal), the presentdisclosure is not limited thereto. In some embodiments, the dummyconductive pillars 120 are laterally separated from one another, andsurrounding at least one of the conductive pillars 118. As shown in FIG.4A, in some embodiments, a group of the conductive pillars 118 enclosedby a dash line (an imaginary line) are surrounded by some of the dummyconductive pillars 120. However, in alternative embodiments, at leastone of the dummy conductive pillars 120 may be disposed within adistribution range of a group of the conductive pillars 118 (e.g., thedash line as shown in FIG. 4A). Moreover, in some embodiments, the dummyconductive pillars 118 and the dummy conductive pillars 120 are spacedapart from one another by a substantially constant spacing. In otherembodiments, the dummy conductive pillars 118 and the dummy conductivepillars 120 are not evenly distributed in the insulating layer 116.

FIG. 4B is a schematic top view illustrating a configuration of theconductive pillars 118 and the dummy conductive pillars 120 a accordingsome embodiments of the present disclosure.

Referring to FIG. 4B, in some embodiments, the dummy conductive pillar120 a is formed in a ring shape (e.g., a rectangular ring shape, acircular ring shape or a polygonal ring shape). At least one of theconductive pillars 118 is surrounded by an inner boundary of thering-shape dummy conductive pillar 120 a. For instance, as shown in FIG.4B, a group of the conductive pillars 118 enclosed by a dash line (animaginary line) are surrounded by the ring-shape dummy conductivepillars 120 a. In addition, in some embodiments, a plurality of thering-shape dummy conductive pillars 120 a are formed in the insulatinglayer 116, and each of the ring-shape dummy conductive pillars 120 aencloses at least one of the conductive pillars 118. In alternativeembodiments, substantially all of the conductive pillars 118 areenclosed by a single ring-shape dummy conductive pillar 120 a.

As above, as compared to forming electrical connectors (e.g.,micro-bumps or the like) at opposite sides of a semiconductor die forinterconnecting with other semiconductor dies, the conductive pillarsand the bonding pads in the present disclosure are formed at a singleside of the semiconductor structure (e.g., a front side of thesemiconductor structure). In this way, several process steps including,for example, flipping over a wafer structure and attaching the waferstructure to an additional carrier are no longer required, and formationof the conductive pillars and the bonding pads can be integrated with aback-end-of-line (BEOL) process of the semiconductor structure.Accordingly, a manufacturing cost of the semiconductor structure isreduced. Moreover, in some embodiments, the dummy pads and the dummyconductive pillars are formed along with the conductive pillars at thefront side of the semiconductor structure. The dummy pads and the dummyconductive pillars may not participate in signal transmitting, but areable to facilitate heat dissipation of the semiconductor structure. Bydisposing the dummy conductive pillars, a thermal resistance of thesemiconductor structure can be effectively lowered.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of the 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC, the use of probesand/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

According to some embodiments, a semiconductor structure comprises: asemiconductor substrate; an interconnection structure, disposed over thesemiconductor substrate; a through substrate via, at least partiallyextending in the semiconductor substrate along a thickness direction ofthe semiconductor substrate, and electrically connected to theinterconnection structure; an insulating layer, disposed over theinterconnection structure; a conductive pillar, disposed in theinsulating layer, and electrically connected to the through substratevia; a dummy conductive pillar, disposed in the insulating layer, andlaterally separated from the conductive pillar; a passivation layer,disposed over the insulating layer; and a bonding pad, disposed in thepassivation layer, and electrically connected to the conductive pillar.

According to some embodiments, a semiconductor structure comprises: astack of semiconductor dies, respectively comprising a semiconductorsubstrate, an interconnection structure, a through substrate via, aninsulating layer, a conductive pillar, a dummy conductive pillar, apassivation layer and a bonding pad, wherein the interconnectionstructure is disposed over the semiconductor substrate, the throughsubstrate via penetrates through the semiconductor substrate andelectrically connects to the interconnection structure, the insulatinglayer is disposed over the interconnection structure, the conductivepillar and the dummy conductive pillar are disposed in the insulatinglayer and laterally separated from one another, the passivation layer isdisposed over the insulating layer, and the bonding pad is disposed inthe passivation layer and electrically connected to the conductivepillar. The bonding pad of an upper semiconductor die in the stack ofsemiconductor dies is bonded with the through substrate via of the lowersemiconductor die in the stack of semiconductor dies.

According to some embodiments, a manufacturing method of semiconductorstructure, comprising: providing a first semiconductor die and a secondsemiconductor die respectively comprising a semiconductor substrate, aninterconnection structure, a through substrate via, an insulating layer,a conductive pillar, a dummy conductive pillar, a passivation layer anda bonding pad, wherein the interconnection structure is disposed overthe semiconductor substrate, the through substrate via at leastpartially extends in the semiconductor substrate along a thicknessdirection of the semiconductor substrate and electrically connects tothe interconnection structure, the insulating layer is disposed over theinterconnection structure, the conductive pillar and the dummyconductive pillar are disposed in the insulating layer and laterallyseparated from one another, the passivation layer is disposed over theinsulating layer, and the bonding pad is disposed in the passivationlayer and electrically connected to the conductive pillar; attaching thefirst semiconductor die onto a base structure, wherein the bonding padof the first semiconductor die is attached with the base structure;removing a portion of the semiconductor substrate of the firstsemiconductor die, such that the through substrate via of the firstsemiconductor die is protruded; forming a first isolation layer over thefirst semiconductor die and the base structure; removing portions of thefirst isolation layer above the through substrate via of the firstsemiconductor die; and attaching the second semiconductor die onto thefirst semiconductor die, wherein the passivation layer of the secondsemiconductor die is attached with the first isolation layer, and thebonding pad of the second semiconductor die is attached with the throughsubstrate via of the first semiconductor die.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor structure, comprising: asemiconductor substrate; an interconnection structure, disposed over thesemiconductor substrate; a through substrate via, penetrating throughthe semiconductor substrate and the interconnection structure, andelectrically connected to the interconnection structure; an insulatinglayer, disposed over the interconnection structure; a conductive pillar,disposed in the insulating layer, and electrically connected to thethrough substrate via; a dummy conductive pillar, disposed in theinsulating layer, and laterally separated from the conductive pillar; apassivation layer, disposed over the insulating layer; and a bondingpad, disposed in the passivation layer, and electrically connected tothe conductive pillar.
 2. The semiconductor structure of claim 1,wherein a front surface of the dummy conductive pillar facing away fromthe interconnection structure is covered by the passivation layer. 3.The semiconductor structure of claim 1, wherein the dummy conductivepillar is electrically floated.
 4. The semiconductor structure of claim1, further comprising: an additional passivation layer, disposed betweenthe interconnection structure and the insulating layer; a conductive padand a dummy pad, disposed in the additional passivation layer, whereinthe conductive pad is electrically connected between the conductivepillar and the through substrate via, and the dummy pad is overlappedand in contact with the dummy conductive pillar.
 5. The semiconductorstructure of claim 4, wherein the conductive pad is electricallyisolated from the dummy conductive pillar and the dummy pad.
 6. Thesemiconductor structure of claim 1, further comprising: an isolationlayer, covering sidewalls of the semiconductor substrate, theinterconnection structure, the insulating layer and the passivationlayer, and covering a back surface of the semiconductor substrate thatis facing away from the interconnection structure.
 7. The semiconductorstructure of claim 6, wherein a back surface of the through substratevia that is facing away from the conductive pillar is substantiallycoplanar with a surface of the isolation layer.
 8. The semiconductorstructure of claim 1, wherein the conductive pillar and the dummyconductive pillar respectively stand on the interconnection structure,and are each laterally surrounded by the insulating layer, and whereinthe bonding pad lies over the conductive pillar, and are laterallysurrounded by the passivation layer.
 9. The semiconductor structure ofclaim 1, wherein the interconnection structure comprises a stack ofdielectric layers and interconnection elements spreading in the stack ofdielectric layers, the through substrate via is electrically connectedto the interconnection elements in the interconnection structure, andthe insulating layer is disposed over a topmost one of the dielectriclayers of the interconnection structure.
 10. The semiconductor structureof claim 1, wherein an amount of the conductive pillar and an amount ofthe dummy conductive pillar are both plural, the plurality of dummyconductive pillars are spaced apart from one another, and at least oneof the plurality of conductive pillars is surrounded by more than one ofthe plurality of dummy conductive pillars.
 11. The semiconductorstructure of claim 1, wherein an amount of the conductive pillar and anamount of the dummy conductive pillar are both plural, the plurality ofdummy conductive pillars are spaced apart from one another, and at leastone of the plurality of conductive pillars is surrounded by a single oneof the plurality of dummy conductive pillars.
 12. A semiconductorstructure, comprising: a stack of semiconductor dies, respectivelycomprising a semiconductor substrate, an interconnection structure, athrough substrate via, an insulating layer, a conductive pillar, a dummyconductive pillar, a passivation layer and a bonding pad, wherein theinterconnection structure is disposed over the semiconductor substrate,the through substrate via penetrates through the semiconductor substrateand electrically connects to the interconnection structure, theinsulating layer is disposed over the interconnection structure, theconductive pillar and the dummy conductive pillar are disposed in theinsulating layer and laterally separated from one another, thepassivation layer is disposed over the insulating layer, and the bondingpad is disposed in the passivation layer and electrically connected tothe conductive pillar, wherein the bonding pad of an upper semiconductordie in the stack of semiconductor dies is bonded with the throughsubstrate via of the lower semiconductor die in the stack ofsemiconductor dies.
 13. The semiconductor structure of claim 12, whereinthe stack of semiconductor dies respectively comprises an isolationlayer, the isolation covers sidewalls of the semiconductor substrate,the interconnection structure, the insulating layer and the passivationlayer as well as a back surface of the semiconductor substrate that isfacing away from the interconnection structure.
 14. The semiconductorstructure of claim 13, wherein the isolation layer of the uppersemiconductor die in the stack of semiconductor dies is bonded with thepassivation layer of the lower semiconductor die in the stack ofsemiconductor dies.
 15. The semiconductor structure of claim 12, whereinthe dummy conductive pillar of the upper semiconductor die in the stackof semiconductor dies is vertically separated from the lowersemiconductor die in the stack of semiconductor dies by the passivationlayer.
 16. A manufacturing method of semiconductor structure,comprising: providing a first semiconductor die and a secondsemiconductor die respectively comprising a semiconductor substrate, aninterconnection structure, a through substrate via, an insulating layer,a conductive pillar, a dummy conductive pillar, a passivation layer anda bonding pad, wherein the interconnection structure is disposed overthe semiconductor substrate, the through substrate via at leastpartially extends in the semiconductor substrate along a thicknessdirection of the semiconductor substrate and electrically connects tothe interconnection structure, the insulating layer is disposed over theinterconnection structure, the conductive pillar and the dummyconductive pillar are disposed in the insulating layer and laterallyseparated from one another, the passivation layer is disposed over theinsulating layer, and the bonding pad is disposed in the passivationlayer and electrically connected to the conductive pillar; attaching thefirst semiconductor die onto a base structure, wherein the bonding padof the first semiconductor die is attached with the base structure;removing a portion of the semiconductor substrate of the firstsemiconductor die, such that the through substrate via of the firstsemiconductor die is protruded; forming a first isolation layer over thefirst semiconductor die and the base structure; removing portions of thefirst isolation layer above the through substrate via of the firstsemiconductor die; and attaching the second semiconductor die onto thefirst semiconductor die, wherein the passivation layer of the secondsemiconductor die is attached with the first isolation layer, and thebonding pad of the second semiconductor die is attached with the throughsubstrate via of the first semiconductor die.
 17. The manufacturingmethod of semiconductor structure of claim 16, wherein the basestructure, the first semiconductor die and the second semiconductor dieare attached together by hybrid bonding.
 18. The manufacturing method ofsemiconductor structure of claim 16, further comprising at least oneannealing process, which is performed after attaching the firstsemiconductor die over the base structure.
 19. The manufacturing methodof semiconductor structure of claim 16, further comprising: removing aportion of the semiconductor substrate of the second semiconductor die,such that the through substrate via of the second semiconductor die isprotruded; forming a second isolation layer over the secondsemiconductor die and the base structure; and removing portions of thesecond isolation layer above the through substrate via of the secondsemiconductor die.
 20. The manufacturing method of semiconductorstructure of claim 19, wherein a portion of the first isolation layersurrounding the first semiconductor die is removed during the step ofremoving the portion of the semiconductor substrate of the secondsemiconductor die.